Accelerating the SMD process of surface mounting is the mainstream direction of industry research and development.
Release time:
2021-11-09
Source:
Source
It is very important to maintain the color purity and luminous intensity. In the past, the method of reducing the driving current was used to reduce the junction temperature. The driving current of most semiconductor lasers was limited to about 20mA. However, the light output of semiconductor lasers increases with the increase of current, and the driving current of many power semiconductor lasers can reach 70mA.
In general, the emission wavelength of the semiconductor laser varies with temperature from 0.2 to 0.3nm/℃, and the spectral width increases, which affects the color vividness. In addition, when the forward current flows through the pn junction, the heat loss causes the temperature rise in the junction region. Near the room temperature, the luminous intensity of the semiconductor laser will be reduced by about 1% for every 1 ℃ increase in the temperature, and the package will dissipate heat. It is very important to maintain the color purity and luminous intensity. In the past, the method of reducing the driving current was used to reduce the junction temperature. The driving current of most semiconductor lasers was limited to about 20mA. However, the optical output of the semiconductor laser will increase with the increase of the current, and the driving current of many power semiconductor lasers can reach 70mA, 100mA or even 1A level, so it is necessary to improve the packaging structure, a new semiconductor laser packaging design concept and a low thermal resistance packaging structure and technology to improve the thermal characteristics. For example, a large-area chip flip-chip structure is adopted, silver glue with good thermal conductivity is selected, the surface area of the metal support is increased, and the silicon carrier of the solder bump is directly mounted on the heat sink. In addition, in the application design, the thermal design and thermal conductivity of PCB circuit board are also very important.
After entering the 21st century, the high efficiency, ultra-high brightness and full color of semiconductor lasers continue to develop and innovate. The luminous efficiency of red and orange semiconductor lasers has reached 100Im/W, that of green semiconductor lasers is 50lm/W, and the luminous flux of single semiconductor lasers has reached tens of Im. Semiconductor laser chips and packages no longer follow Gong's traditional design concept and manufacturing mode. In terms of increasing the light output of the chip, research and development are not only limited to changing the amount of impurities, lattice defects and dislocations in the material to improve the internal efficiency. At the same time, how to improve the internal structure of the die and package, enhance the probability of photon emission from the semiconductor laser, improve the light efficiency, solve heat dissipation, and optimize the design of light and heat sink, improving optical performance and accelerating the SMD process of surface mount is the mainstream direction of industry research and development.
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